The Intellectual Property Office of RA has implemented in its electronic system for receiving applications the ability to present the materials of applications for inventions and industrial designs using 3D models.
Starting today, it will be possible to submit invention and industrial design applications using 3D models.
A visual representation of an invention or industrial design in three dimensions must be provided in at least one of the STEP, U3D, OBJ or STL formats.
The maximum file size must not exceed 50 MB.